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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
November 2005
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Features
Very Low Ground Current (IGND = 1mA) Excellent Line Regulation Excellent Load Regulation Very Low Transient Overshoot Stable with low ESR Output Capacitor (ESR = 0m) Thermal Shutdown Current Limit Output Options: 3.3V and 1.8V
Description
The FAN1539/FAN1540 series of high current LDOs (1.0A and 1.3A) has been developed for portable applications where low quiescent current is an important requirement. The device features excellent line and load transient response which does not exceed 10% of nominal output value for full operating temperature range even during power ON cycle and short circuit removal. Internally trimmed, temperature compensated bandgap reference guarantees 2.5% accuracy for full range of input voltage, output current and temperature. Included on the chip are accurate current limit and thermal shutdown protection. Device stability is achieved with only two external low ESR ceramic capacitors. The FAN1539/FAN1540 is available in thermally enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP and 3-lead TO-252 packages. The 5x6mm MLP package version features a separate Kelvin sense pin for high precision applications.
Applications
Disk Drive Circuits Desktop Computers Laptop, Notebook Computers General Purpose Three Terminal Regulator
Ordering Information
Product Number
FAN1540MMPX FAN1539MPX FAN1540MPX FAN1540DX FAN1540D18X
Output Voltage
3.3V 3.3V 3.3V 3.3V 1.8V
Package
5x6mm 8-Lead MLP in T&R 3x3mm 6-Lead MLP in T&R 3x3mm 6-Lead MLP in T&R 3-Lead TO-252 in T&R 3-Lead TO-252 in T&R
Tape and Reel Information
Quantity
3000
Reel Size
7"
Width
8mm
(c)2005 Fairchild Semiconductor Corporation
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Block Diagram
VIN VOUT
BANDGAP REFERENCE
X
CURRRENT LIMIT ERROR AMPLIFIER
(Note 1)
VSENSE
(Note 2)
START-UP CIRCUIT
THERMAL SHUTDOWN
GND
Notes: 1. No connection for FAN1540MMPX. 2. VSEN available for FAN1540MMPX.
Pin Assignments
TOP VIEW GND VOUT VSEN VIN
1 8
GND GND GND GND
NC VOUT VIN
1 2 3
6 5 4
GND NC NC
2
7
FAN1540
3 6 4 5
FAN1540
FAN1539/FAN1540 3x3mm 6-Lead MLP
5x6mm 8-Lead MLP
VOUT GND
VIN
3-Lead TO-252 PACKAGE
Pin Description
Symbol
VIN GND VOUT VSEN NC Input pin Ground Pin (Tab) Output pin: Fixed Output Voltage Output sense pin. Connect to VOUT if Kelvin sensing is not required No Connection
Name and Function
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Absolute Maximum Ratings
Parameter
Operating Input Voltage Power Dissipation Short Circuit Output Current Operating Junction Temperature Range Thermal Resistance-Junction to Tab, TO-252 Thermal Resistance-Junction to Tab, 3mmx3mm 6-lead MLP (Note 3) Thermal Resistance-Junction to Tab, 5mmx6mm 8-lead MLP (Note 3) Storage Temperature Range (Note 3) Lead Temperature (I.R. Reflow) 30 Sec. (Note 4) Lead Temperature (Soldering) 10 Sec. (Note 4) Electrostatic Discharge Protection (Note 5) HBM CDM
Symbol
VIN PD IOSH TJ JC JC JC TSTG TLEAD TLEAD ESD
Value
10 Internally Limited Internally Limited 0 to 150 3 8 4 -65 to 150 240 260 4 2
Units
V W A C C/W C/W C/W C C C kV
Notes: 3. Junction to ambient thermal resistance, JA, is a strong function of PCB material, board thickness, thickness and number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.Thermal resistance (JA), VIN, IOUT must be chosen not to exceed TJ = 150C. 4. Soldering temperature should be 260C for 10 second after 240C for 30 second in I.R. reflow using 60/40 solder. Maximum rate of temperature rise is 3C/SEC to within 100C of the final temperature. 5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX
Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0C TJ 125C.
Test Conditions Parameter
Output Voltage FAN1540 Line Regulation Load Regulation Dropout Voltage (Note 6) Current Limit Min. Output Current for regulation (VOUT 3%) Temperature Stability RMS Output Noise (Note 7) Ripple Rejection Ratio (Note 8)
Test Limits Min.
3.234 3.217
Symbol
VOUT
VIN
4.75V VIN 5.25V
IOUT
5mA IOUT IMAX 5mA IOUT IMAX 5mA IOUT FAN1539 IMAX FAN1540 IOUT = IMAX
Typ.
3.300 2 25 30 0.9 3.3
Max.
3.366 3.383 15 35 40 1.2
Units
V mV mV V A
REG(LINE) 3.0V VIN 5.25V REG(LOAD) VD IS IOMIN 5.5V 4.75V
0
mA
TS VN
IOUT = 5mA IOUT = IMAX
0.3 0.003
% %VOUT
RA
5V
IOUT = 10mA IOUT = 100mA IOUT = IMAX
65 63 45
75 73 57 2.0 10 (undershoot or overshoot of VOUT)
dB
Transient Response Change of VOUT with step load change (Note 9)
V OUT -----------------I OUT
5V
1mA to IMAX tr 1S IMAX to 1mA tf 1S
%
Transient Response Change of VOUT with application of VIN (Note 9) Transient Response Short circuit Removal Response (Note 9) Quiescent Current
V OUT -----------------V IN
0 to 5V Step Input tr 1S 10% to 90%
1mA IOUT IMAX
5.0
10 (undershoot or overshoot of VOUT)
%
V OUT -----------------V IN @IOUT = short IGND
5V
IOUT = short to IOUT = 10mA
5.0
10 (overshoot or undershoot of VO) 2.0
%
VIN 7V
IOUT = 0mA
1.0
mA
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued)
Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0C TJ 125C.
Test Conditions Parameter
Quiescent Current Quiescent Current Thermal Shutdown Thermal Hysteresis
Test Limits Min. Typ.
1.0 1.0 160 15
Symbol
IGND IGND TjSD THYST
VIN
VIN 7V VIN = 5V 3.0V VIN 5.25V 3.0V VIN 5.25V
IOUT
2mA IOUT IMAX 0mA IOUT 50mA
Max.
2.0 2.0
Units
mA mA C C
Notes: 6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 5V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22F, COUT = 10F. Both capacitors are low ESR X7R type.
Test Circuit
VIN IN CIN 22F GND
VOUT
DUT
OUT 10F COUT
Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible.
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics--FAN1540D18X
Unless otherwise specified, VIN = 3.135V to 3.465V, Tj = 25C, IMAX = 1.3A. Boldface limits apply over operating junction temperature range of 0C TJ 125C.
Test Conditions Parameter
Output Voltage Line Regulation Load Regulation Dropout Voltage (Note 6) Current Limit Min. Output Current for regulation (VOUT 3%) Temperature Stability RMS Output Noise (Note 7) Ripple Rejection Ratio (Note 8) Transient Response Change of VOUT with step load change (Note 9)
Test Limits IOUT Min. Typ.
3 20 0.9 2.5 0
Symbol
VOUT REG(LINE) REG(LOAD) VD IS IOMIN
VIN
3.15V VIN 3.465V 3.135V VIN 3.465V 3.3V
Max.
1.845 10 40 1.2
Units
V mV mV V A mA
5mA IOUT IMAX 1.755 1.800 5mA IOUT IMAX 5mA IOUT IMAX IOUT = IMAX
3.3V
TS VN RA V OUT -----------------I OUT 3.3V 3.3V
IOUT = 5mA IOUT = IMAX IOUT = 500mA 1mA to IMAX tr 1S IMAX to 1mA tf 1S 40
0.3 0.003
% %VOUT dB
2.0
10 (undershoot or overshoot of VOUT)
%
Transient Response Change of VOUT with application of VIN (Note 9) Transient Response Short circuit Removal Response (Note 9) Quiescent Current Quiescent Current Thermal Shutdown Thermal Hysteresis
V OUT -----------------V IN
0 to 1.8V Step Input tr 1S 10% to 90%
1mA IOUT IMAX
3.0
10 (undershoot or overshoot of VOUT)
%
V OUT -----------------V IN @IOUT = short IGND IGND TjSD THYST
3.3V
IOUT = short to IOUT = 10mA
3.0
10 (overshoot or undershoot of VO)
%
3.3V 3.3V
IOUT = 0mA 2mA IOUT IMAX
1.0 1.0 160 10
2.0 2.0
mA mA C C
Notes: 6 Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 3.3V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22F, COUT = 10F. Both capacitors are low ESR X7R type.
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Test Circuit
VIN IN CIN 22F GND
VOUT
DUT
OUT 10F COUT
Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible.
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX
Output Voltage vs. Temperature
3.310 3.305 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0 50 100 150 0 50 100 150
Ground Pin Current vs. Temperature
V IN = 5V I OUT = 10mA
3.300 3.295 3.290 3.285 3.280 3.275 -50
V IN = 5V
VIN = 5V= 10mA I OUT IOUT = 5m A Typical 3.3V Device Typical 3.3V Device
Ambient Temperature (C)
Quiescent Current (mA)
Output Voltage (V)
Ambient Temperature (C)
Ground Pin Current vs. Input Voltage
1.20 1.07 1.06 1.05 1.04 1.03 1.02
Ground Pin Current vs. Output Current
Quiescent Current (mA)
1.10 1.05 1.00 0.95
I OUT = 10 mA
0.90 0.85 4 5 6 7 8 9 10
Quiescent Current (mA)
1.15
V IN = 5V
1.01 1.00 0 200 400 600 800 1000 1200 1400
Input Voltage (V)
Output Current (mA)
Dropout Voltage vs. Temperature
1.2 1.1 3.5 3.0
Output Voltage vs. Output Current
Dropout Voltage (V)
Output Voltage (V)
1.0
2.5 2.0
I OUT = 1.3 A
0.9 0.8 0.7 0.6 -50
IO U
IO
UT
T
= 1A
VIN = 5V
1.5 1.0 0.5 0.0 0. 0
T j = 25C
= 0. 5A
0
50
100
0.5
1. 0
1. 5
2. 0
2.5
3. 0
3. 5
Ambient Temperature (C)
Output Current (A)
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued)
Line Transient Response
Output Voltage (50mV/div) Output Voltage (20mV/div)
I OUT = I MAX
Load Transient Response
3.300V
VIN = 5V
3.300V
C IN = 22F C OUT = 10F (Ceramic Low ESR Capacitors)
CIN = 22F C OUT = 10F (Ceramic Low ESR Capacitors)
Output Voltage (2.5V/div)
Output Current (0.5A/div)
t r = 1s t f = 1s T j = 25C
t r = 1s Tj = 25C
Time (20s/div)
Time (20s/div)
Short Circuit Removal Response
Output Voltage (50mV/div)
100
Ripple Rejection vs. Frequency
3.300V
VIN = 5V
90
Ripple Rejection (dB)
80 70 60 50 40 30 20 10 0 10 1
VIN = 5V I OUT = 10mA COUT = 10F (Low ESR)
CIN = 22F C OUT = 10F (Ceramic Low ESR Capacitors)
Output Current (2.5A/div)
~3.3A
t f = 1s
10 mA
T j = 25C
10 2
10 3
10 4
10 5
10 6
Frequency (Hz)
Time (40s/div)
Output Spectral Noise Density vs. Frequency
2.0 1000
Typical Region of Stability ESR vs. Output Current*
ESR (m) (Equivalent Series Resistance)
Output Spectral Noise Density (Vrms/rtHz)
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 CIN = 22F COUT = 10F Ceramic Low ESR 100 1K 10K 100K VIN = 5V IOUT = IMAX
Region of Instability
100
Region of Stability
10
1
VIN = 5V CIN = 22F COUT = 10F Tj = 25C 0 200 400 600 800 1000 1200 1400
0.1
Fr eq ue ncy (H z)
Output Current (mA) *Note: ESR Values measured at f = 10kHz
Note: Transient response tests require short lead lengths and low resistance connections at source and load.
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics--FAN1540D18X
Output Voltage vs. Temperature
1.810 1.805 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0 50 100 150 0 50 100 150
Ground Pin Current vs. Temperature
1.800 1.795 1.790 1.785 1.780 1.775
VIN = 3.3V I OUT = 10mA Typical 1.8V Device
Ambient Temperature (C)
Quiescent Current (mA)
Output Voltage (V)
VIN = 3.3V I OUT = 10mA
Ambient Temperature (C)
Ground Pin Current vs. Input Voltage
1.20 1.07 1.15 1.10 1.05 1.00 0.95 0.90 0.85 3 4 5 6 7 8 9 10
I OUT = 10mA
Ground Pin Current vs. Output Current
1.06 1.05 1.04 1.03 1.02 1.01 1.00 0 200 400 600 800 1000 1200 1400
V IN = 3.3V
Quiescent Current (mA)
Input Voltage (V)
Quiescent Current (mA)
Output Current (mA)
Dropout Voltage vs. Temperature
1.2 1.1 1.9
Output Voltage vs. Output Current
Dropout Voltage (V)
1.8
1.0 0.9 0.8 0.7 0.6 -50
Output Voltage (V)
I OUT = 1.3A
IO U
IO
UT
1.7
T
= 1A
1.6
= 0. 5A
1.5
VIN = 3.3V T j = 25C
0
50
100
1.4 0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature (C)
Output Current (A)
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Applications Information
General Circuit Description
The FAN1539/FAN1540 is an advanced low dropout voltage regulator, specially designed for applications in portable computers, where high performance and low quiescent current are required. The device has an internal trimmed bandgap voltage reference and an internal output voltage sense divider. These two signals form the input to the error amplifier which regulates the output voltage. The FAN1539/FAN1540 has a complete set of internal protection circuitry including thermal shutdown, short circuit current limit and electrostatic discharge protection. Low ESR ceramic capacitors are needed for input as well as output pins to maintain the circuit stability. The ground pin current, IGND can be found in the charts provided in the "Electrical Characteristics" section. The relationship describing the thermal behavior of the package is: T J ( max ) - T A P D ( max ) = -------------------------------- JA where TJ(max) is the maximum allowable junction temperature of the die, which is 150C, and TA is the ambient operating temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the 6-lead MLP package is specified at 8C /W, the JA for a minimum PWB footprint will be in substantially higher. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, and the thickness of the copper layer, the resulting JA can vary over a wide range. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing thermal resistance. Thermal simulations performed on a thermally optimized board layout indicate that JA as low as 20C /W can be achieved. For example, the heat contributed by the dissipation of other devices located nearby must be included in the design considerations. Overload conditions also need to be considered. It is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to a persistent fault condition.
Short Circuit Current Limit
The device has internal over-current limit and short circuit protection. Under over-current conditions the device current is determined by the current limit threshold. Once the device is released from short circuit conditions, the normal level of current limit is gradually re-established as the device output voltage reaches normal levels. Special circuitry has been added to ensure that recovery from short circuit current conditions does not lead to excessive overshoot of the output voltage -- a phenomenon often encountered in conventional regulators.
Thermal Protection
The FAN1539/FAN1540 is designed to supply at least 1A/1.3A output currents. Excessive output load at high input-output voltage difference will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 160C, an onboard thermal protection will disable the output until the temperature drops approximately 15C below the limit, at which point the output is re-enabled.
Capacitor ESR and Printed Circuit Board Layout
The FAN1539/FAN1540 has been optimized to accommodate low ESR bypass capacitors down to 0 m. For best results it is important to place both input and output bypass capacitors as near to the input and output pins as possible. Use of X7R types such as Murata's GRM31CR70J106KA01B (10F) and GRM43ER71A226KE01B (22F) or similar component from TDK. The capacitors should connect directly to the ground plane. Use of ground plane on the top and the bottom side of the PCB is recommended. As many vias as possible should be used to minimize ground plane resistance.
Thermal Characteristics
The FAN1539/FAN1540 is designed to supply at least 1A/1.3A at the specified output voltage with an operating die (junction) temperature of up to 125C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the actual thermal resistance depends on the thermal characteristics of the chosen package and the surrounding PC board copper to which it is mounted. The power dissipation is equal to the product of the input-to-output voltage differential and the output current plus the ground current multiplied by the input voltage, or: P D = ( V IN - V OUT )I OUT + V IN I GND
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
5x6mm 8-Lead MLP
5.0 A B 4.50
6.0
3.50 4.25
6.25
0.25 2X
C
(1.00)
0.25 2X
C
TOP VIEW
1.27 TYP
0.65 TYP
LAND PATTERN RECOMMENDATION
0.10 C (0.25) 1.0 MAX 0.08 C 0.05 0.00
SIDE VIEW
4.25 A 1.75 1 2 3 4
C SEATING PLANE
PIN #1 IDENT. (OPTIONAL)
0.75 A 0.35
3.25 A 1.25
NOTES: A) B) C)
DOES NOT FULLY CONFORM TO JEDEC REGISTRATION MO-229, DATED 11/2001. DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCES PER ASME Y14.5-1994.
8 1.27
7
6
5
0.28-0.40 A 0.10 M C A B
3.81 A
0.05 M C
BOTTOM VIEW
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
3x3mm 6-Lead MLP
0.15 C 2X 0.10 C 2X 2.6 3.0 1.85 2.15 3.45 3.0 A B 2.45
(0.65) 0.10 C 2X TOP VIEW 1.0 MAX 0.10 C 0~12
1.00 0.65
2.6
0.15 C 2X 0.95 TYP 0.65 TYP
RECOMMENDED LAND PATTERN
0.08 C 0.05
0.00 SEATING PLANE
(0.20) SIDE VIEW 2.25 1 0.95 3
C
0.45 0.20
1.65
0.2 MIN
6 1.90
4
0.30~0.45
O0.10 M C A B O0.05 M C
BOTTOM VIEW NOTES: A. CONFORMS TO JEDEC REGISTRATION MO-229, VARIATION VEEA, DATED 11/2001 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
3-Lead TO-252
6.73 6.35 5.46 5.21 A 6.00 MIN
L3
4 6.50 MIN
D 1.02 0.64 C 1 2 3 1 1.14 0.76 2.29 4.57 3 6.25
3.00 MIN
(0.59) 0.89 0.64 0.25 M A M C
1.40 MIN 4.60
2.30
LAND PATTERN RECOMMENDATION
B 2.39 2.18
SEE NOTE D
E1
4
0.58 0.46
D1 10.41 9.40
SEE DETAIL A
2 3
1
0.10 B
GAGE PLANE 0.61 0.46 10 0
0.51
NOTES: UNLESS OTHERWISE SPECIFIED A) ALL DIMENSIONS ARE IN MILLIMETERS. B) THIS PACKAGE CONFORMS TO JEDEC, TO-252, ISSUE C. VARIATION AA & AB, DATED NOV. 1999. (1.54) C) D) DIMENSIONING AND TOLERANCING PER ASME Y14.5-1994. HEAT SINK TOP EDGE COULD BE IN CHAMFERED CORNERS OR EDGE PROTRUSION. DIMENSIONS L3, D, E1 & D1 TABLE: OPTION AA OPTION AB L3 0.89 - 1.27 1.52 - 2.03 D 5.97 - 6.22 5.33 - 5.59 E1 4.32 MIN 3.81 MIN D1 5.21 MIN 4.57 MIN
1.78 1.40 (2.90)
0.127 MAX SEATING PLANE
E)
DETAIL A
(ROTATED -90) SCALE 12X
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FAN1539/FAN1540 Rev. 1.1.1
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I17
15
www.fairchildsemi.com
FAN1539/FAN1540 Rev. 1.1.1

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